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17104 / Product Engineer Intern
Intel Corporation

Position Information

1
Mon-Fri (8-5)
40
Depend on Exper
No
3/6/2017
7/15/2017
No
Our organization is the motherboard and system research and development arm within Intel. Our internal factory assembles prototypes of next generations smartphones, tablets, ultrabooks, wearable devices, servers, supercomputers and other electronic devices. We are looking for a self starter with strong communications skills and the ability to apply classroom learnings to solve complex assembly problems associated with next generation devices. Our intern will be exposed to surface mount technology, bill of material analysis, tolerance stackup analysis, design for manufacturing, project management, printed circuit boards, electrical test, statistical methods, and product development.
The candidate must be in good standing with the school they are attending and pursuing a degree in mechanical, manufacturing, electrical or chemical engineering.

Posting Information

Hillsboro, Oregon
Engineering
Internship - Paid
3.0000
Non-degree Seeking
Other
Chemical Engineering, Electrical and Computer Engr, Manufacturing Engineering, Mechanical Engineering
3/3/2017
4/28/2017

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